Polyimide Film is synthesized by the polycondensation of aromatic dianhydride and aromatic diamine (PMDA and ODA). 

It shows outstanding physical, thermal, electrical, and chemical properties over a wide range of temperature as low as -452F(-269C)

and as high as 500F(+260C).It also offers good dimensional stability and can be die-cut, laminated, metallized, formed, thermoformed

or adhesive coated.